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Critical Bottlenecks Shift Beyond Chip Fabrication to Memory, Packaging, and Materials

Despite intense focus on leading-edge semiconductor production, the AI supply chain's most acute constraints are emerging in high-bandwidth memory, advanced packaging capacity, and specialty materials like helium and LNG required for chip fabrication.

2 signals tracked

  1. NVIDIA's Rubin delayed by HBM shortages while Taiwan demands strategic stockpiles of helium

  2. Infrastructure bottlenecks shift from chips to power and cooling as physical constraints bind