Power, Grid Access, and the Consolidation of AI Compute Capacity
Two developments this week reinforce the same underlying dynamic: the AI infrastructure buildout is becoming structurally harder for anyone without deep capital and vertical integration. FERC's new interconnection framework rewards facilities that generate their own power, disadvantaging mid-tier colocation operators and conversion projects — exemplified by the North Tonawanda moratorium blocking Digi Power X's cryptomine repurposing. Meanwhile Amazon's reported move to sell Trainium externally, if confirmed, would pit a hyperscaler's proprietary silicon directly against NVIDIA in the merchant market, a competitive threat that only a company already monetising its own chip programme at AWS scale could credibly mount.
The infrastructure consolidation thesis extends into the semiconductor supply chain. Intel's 18A progress at VLSI matters precisely because a credible second leading-edge foundry would reduce the AI industry's single-point dependency on TSMC — but the gap between technical validation and production readiness remains real. Advanced packaging is emerging as the next chokepoint, with Amkor's Intel win underscoring that chiplet integration and high-bandwidth memory stacking now concentrate manufacturing risk in a similarly small number of OSAT providers. Slovenia's FRIDA launch and the broader European sovereign compute wave represent a deliberate counterweight: distributed national investments designed to operate outside this consolidation dynamic entirely.